Xstation HS
In-line High Speed Automated X-Ray Inspection (AXI) System

World's Fastest AXI Solution
The XStation HS inspection system is capable of providing uncompromising defect coverage at the speed of your line.  Teradyne's transmission X-ray technique provides users with full volumetric analysis of solder joints at triple the speed of Laminographic  X-ray inspection.  Electronics manufacturers now have an X-ray inspection solution with the speed and fault resolution required to inspect the latest package technologies, including: BGA's, CSP's, and FCA's.

• Fastest throughput of any AXI system

• Triple the speed of X-ray Laminography

• Best image quality of any AXI system

• Lead-free solder inspection capable

• Provides full volumetric analysis of solder joints
• Fixtureless inspection for faster, lower cost test
• Improves product reliability by identifying structural faults not tested by other inspection methodologies
• Provides measurement data for trend analysis and process control
• Excellent diagnostic resolution for rapid debug and repair

• High fault coverage

• safe low voltage test

• Fast test throughput

• Exceptional diagnostic accuracy

• Proven test reliability

• Scalable test capabilities

• Low cost of ownership

• High pin count

• Small footprint

Test Station SE
Price break through for full capability in-circuit test system
The TestStation SE is a result of over 25 years of experience and leadership in the area of in-circuit test (ICT).  It features the technology, proven reliability, and convenience that you have come to expect from Teradyne, and represents the best in-circuit test value at the best price for high-volume electronics manufacturers needing flexibility and adaptability in manufacturing process test.  Everything is included with the TestStation SE: computer, software, vector-less testing, and Teradyne's award winning,  worldwide network of support and service.  All at a price that rivals some MDA's.

• No-Compromise In-Circuit Test
• Rapid Program Development
• Comprehensive Test Tool Set
• Low Cost of Ownership
• Small Footprint

Spectrum 8800 - Series

Today's high-volume electronics products require a new level of manufacturing and test capability.  Ever-shrinking product cycles and unpredictable changes in demand and shipping levels mean you need rapid line set up and changeover, highline rates, and minimum Work In Process (WIP).  Your customers' demand for lower-cost products translates into a continuous "cost-down" strategy in manufacturing and test.

And when it comes to communications and computer products like network switches, cell phones. PDAs, and laptops, you need a manufacturing and test capability than can handle mixed-signal and RF, low-power technologies, and increasingly dense packaging.

Whatever your technical challenge, the Spectrum 8800-Series VXI Manufacturing Test Platform can help you meet it.  Designed for high-volume manufacturing environments at OEMS and contract manufacturers, the Spectrum 8800-Series delivers the following:>

• Highest process fault coverage, including full vectorless test.

• High-performance analog and mixed-signal test.

• Prototype in-circuit test program in four hours or less.

• Production test program in three days.

• Fixture build in three days.

• Meet a line rate of 10-15 seconds.

• Automation ready for in-line deployment.

• Low capital and running costs.

• Full data-collection facilities.

• Platform for reducing test steps and improving final-test stage yields.